cte mismatch meaning in English
电缆终端设备失配
Examples
- Cte mismatch cable temination equipment
电缆终端设备失配 - Obviously , cte mismatch induced thermal stresses is one of the biggest characteristic in mmc because cte mismatch is usually very serious in most of mmc
显然，热膨胀系数不匹配诱导的热应力是金属基复合材料的一大特征，因为对于大多数金属基复合材料来说，热膨胀系数不匹配是很严重的。 - Two kinds of thermal residual stresses exist in metal matrix composites ( mmc ) . one of them is temperature gradient induced thermal stresses caused by temperature gradient in mmc . the other can develop upon cooling from the processing temperature to room temperature due to the coefficient of thermal expasion ( cte ) mismatch between the fiber and matrix and is called cte mismatch induced thermal stresses
金属基复合材料( mmc )有两种形式的热应力，一种是在mmc中由于温度梯度引起的热应力，即温度梯度诱导的热应力；另一种是在冷却过程中由于基体金属和纤维的热膨胀系数不匹配引起的热应力，即热膨胀系数不匹配诱导的热应力。 - However , the die attach layer delaminated after 500 cycles and pcb cracked in the underfilled samples after long time cycling . c - sam is employed to investigate the delamination in the underfilled samples . highly concentrated stress - strain induced by the cte mismatch between the bga component and the pcb board , coarsened grain and two kinds of intermetallic compounds ( nisn / nisns ) which formed during reflow and thermal cycle and their impact on the reliability of solder joints are discussed in this paper
充胶样品粗化尤为严重； ? ni - sn金属间化合物包括两层：其中，靠近ni焊盘的那层比较平整，同时， eds结果分析表明其化学式近似为nisn ，而靠近焊料的那层呈板条状，化学式近似为nisn _ 3 ，文献表明其为亚稳相； ?充胶使得样品最大应力范围降了接近一个数量级并降低了dnp的作用，同时，器件失效模式变为芯片粘接层分层； ? c - sam结果表明本论文采用的充胶样品，芯片粘接层分层起始于500周左右，而经过2700周循环的样品，分层几乎扩展到整个界面。 - So this question must be solved at first . a variety of factors which influence cte mismatch induced thermal stresses such as fiber array , temperature dependent material properties , composites fabrication temperature and pressure has been discussed . on the other hand , the temperature gradient induced thermal stresses is also analysed and factors such as heat treatment conditions , composites fabrication temperature and pressure to influence the stresses are investigated
本文首先利用ansys模拟基体材料分别处于理想弹性应力状态和理想弹塑性应力状态时，各种因素诸如纤维排布模式、模量等性能参数是否随温度变化以及复合材料制备温度和压力对热膨胀系数不匹配诱导热应力的影响；另外，我们也对温度梯度诱导热应力进行了一定的研究，分析了各种热处理工艺以及材料制备温度、压力对它的影响。
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